Maximum Number of Layers: 32

Maximum Board Thickness: 0.300”+

Minimum Board Thickness: 0.016”  for Multi-Layer.
0.004”  for 1 & 2-Layer

Maximum Board Length: 22” for Multi-Layer

So far we've made a PCB 45” long for 2-Layer (it was about 3” wide).

Maximum Board Dimensions: 21” x 24”

Minimum Line Spacing: 0.004” for Production Runs

0.003” for Protos & certain Prod. runs

0.002” In certain situations

Minimum Circuit Width: 0.004” for Production Runs

0.003” for Prototypes

Minimum Hole Size: 0.004”

Maximum Outer Copper Thickness: 10 oz.

Maximum Inner Copper Thickness: 5 oz.

Maximum Warpage Allowed: 0.010 inch / inch

Maximum Registration Deviation: 0.0015”

Maximum Hole Size Deviation: 0.0005”

Maximum Pad Size Deviation: +- 10%

Maximum Trace Width Deviation: +- 10%

Blind & Buried Vias: Yes

Plugged Vias: Yes, including all methods: With Soldermask, with non-conductive epoxy and with silver. The 2 step method plating over the plugged via again is also available (According to IPC 600 F).

CEM-1: Yes

FR-4: Yes

CEM-3: Yes

Polyimides (various): Yes

BT-Epoxy: Yes

FR-406: Yes

GETEK: Yes

FR-408: Yes

Rogers: Yes

Teflon (various): Yes

Brass Substrate: Yes

Aluminum Substrate: Yes

Ammonia Etch: Yes    

Petra Etch: Yes

HASL: Yes   

Tin-Lead Plating: Yes

RoHS Lead-free Tin Plating: Yes

Tin-Nickel Plating: Yes

Selective Gold Plating: Yes

Nickel Plating: Yes

 

Hard Gold: Yes

SMOBC: Yes

Flash Gold: Yes

Wire Bondable Gold: Yes

PISM: Yes

OSP Finish: Yes

LPISM: Yes

Controlled Impedance: Yes

Embedded Resistance: Yes

Flex: Yes    

Rigid-Flex: Yes