| Maximum Number of Layers: | 32 |
|---|---|
| Maximum Board Thickness: | 0.300"+ |
| Minimum Board Thickness: | 0.016” for Multi-Layer. |
| Maximum Board Length: | 22” for Multi-Layer 45' for 2-layer |
| Maximum Board Dimensions: | |
| Minimum Line Spacing: | 0.004” for Production Runs 0.003” for Protos & certain Prod. runs |
| Minimum Circuit Width: | 0.004” for Production Runs 0.003” for Prototypes |
| Minimum Hole Size: | 0.004” |
| Maximum Outer Copper Thickness: | 15 oz. |
| Maximum Inner Copper Thickness: | 5 oz. |
| Maximum Warpage Allowed: | 0.010 inch / inch |
| Maximum Registration Deviation: | 0.0015” |
| Maximum Hole Size Deviation: | 0.0005” |
| Maximum Pad Size Deviation: | +- 10% |
| Maximum Trace Width Deviation: | +- 10% |
| Blind & Buried Vias: | Yes |
| Plugged Vias: | Yes, including all methods: With Soldermask, with non-conductive epoxy and with silver. The 2 step method plating over the plugged via again is also available (According to IPC 600 F). |
| Materials | |
| CEM-1: | Supported |
| FR-4: | Supported |
| CEM-3: | Supported |
| Polyimides (various): | Supported |
| BT-Epoxy: | Supported |
| FR-406: | Supported |
| GETEK: | Supported |
| FR-408: | Supported |
| Rogers: | Supported |
| Teflon (various): | Supported |
| Brass Substrate: | Supported |
| Aluminum Substrate: | Supported |
| Ammonia Etch: | Supported |
| Petra Etch: | Supported |
| HASL: | Supported |
| Tin-Lead Plating: | Supported |
| RoHS Lead-free Tin Plating: | Supported |
| Tin-Nickel Plating: | Supported |
| Selective Gold Plating: | Supported |
| Nickel Plating: | Supported |
| Hard Gold: | Supported |
| SMOBC: | Supported |
| Flash Gold: | Supported |
| Wire Bondable Gold: | Supported |
| PISM: | Supported |
| OSP Finish: | Supported |
| LPISM: | Supported |
| Controlled Impedance: | Supported |
| Embedded Resistance: | Supported |
Supported Base Materials
